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Trim Design Dominates Upcoming Developments in Avionics
Business opportunities for cable assembly and connector suppliers will center on narrow body airframes.

By Tom Dlugolecki, Bishop & Associates Inc.

One confirmation  the recent American Airline aircraft purchase gives us is that the requirement for narrow body aircraft continues to increase as older narrow bodies are phased out and new markets are developed. Additionally, the narrow body market has become the battleground where new aircraft builders, such as Bombardier with their CSeries; Comac (China) and the C919; and the Russian Irkut MS-21, are posing a threat to Airbus/Boeing. It’s clear that this is the profile that will dominate avionics for some time to come.

Both Airbus and Boeing are making new decisions on product development and production, which will impact cable assembly and connector manufacturers. Now interconnection industry manufacturers must consider whether existing standards can be used or whether new designs are necessary. A quick review shows existing and new requirements in each of the six commercial aviation interconnection application areas:

  • Avionics and in-flight entertainment

  • Aircraft electrical interconnection harnesses

  • Aircraft interiors

  • Wings, landing gear, and engine

  • Power distribution

  • Sub-assemblies design

     
Boeing 747 Electronics Bay and Terminal blocks

Cable assemblies for interconnect products in avionics and IFE (in-flight entertainment) will largely contain blind mate rack and panel connectors; rugged MIL spec or other circular connectors; RF connectors; terminal block type connectors; low insertion force contacts; fiber-optic connectors; high-voltage connectors; RFI protection; front release and rear release contacts; environmentally sealed connectors; composite shelled connectors; D-subminiature connectors; micro-D connectors, filtered contacts, and hermetically sealed connectors. One of the more recent requirements for the rack and panel interconnection solution is the IFE (In-Flight Entertainment System). ITT Interconnect Solutions has developed a custom ARINC 600 connector designed specifically for IFE systems (pictured right). More recently, other new products are being developed, such as the “Fiber To The Screen” product by Lumexis and TE, which reduces weight and increases reliability with quasi-commercial designs.

The E/E (electrical equipment) bay determines much change throughout the aircraft, as avionics box manufacturers continue to innovate and pursue new markets and customers. One major new market force is the entrée of global airliner manufacturers, such as Comac and Irkut. As LRU (line replaceable unit) manufacturers pursue new global aircraft builders in China and Russia, these newcomers will provide certified avionics solutions. Honeywell is developing the fly-by-wire flight control system and the inertial reference system with China's Flight Automatic Control Research Institute.

Rockwell Collins is the integrator on the ARJ21. It is also developing the communication and navigation system jointly with China Electronics Technology Avionics and an integrated surveillance system with the Leihua Electronic Technology Research Institute. Irkut has selected Rockwell Collins to provide avionics and controls for the MS-21. Expect both standards and new design modifications for these programs.

Future articles will address industry interconnect requirements from concept to development to manufacture to the MRO and Life Cycle Management of commercial aircraft. As defense spending declines in the United States and in much of the Western world and commercial aircraft are needed to replace aging fleets and address new markets, expect to see significant innovation and changes.


Tom Dlugolecki, Bishop & Associates Inc.
Market Segment Director — Commercial Aviation, Bishop & Associates Inc.
Tom Dlugolecki joined Bishop & Associates in 2011, and brings a military and corporate career lifetime of aerospace and defense business and technical knowledge. His knowledge of hardware/software design, development, manufacture, and integration of complex technological system/network products and services gives him insights into the future of the electronic interconnectivity industry. His primary focus is civil aerospace. He can be reached at tdlugolecki@bishopinc.com.

 

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