Trim Design Dominates Upcoming
Developments in Avionics
Business opportunities for
cable assembly and connector suppliers will center on narrow
body airframes.
By Tom
Dlugolecki, Bishop & Associates Inc.
One confirmation the recent American Airline aircraft purchase
gives us is that the requirement for narrow body aircraft
continues to increase as older narrow bodies are phased out and
new markets are developed. Additionally, the narrow body market
has become the battleground where new aircraft builders, such as
Bombardier with their CSeries; Comac (China) and the C919; and
the Russian Irkut MS-21, are posing a threat to Airbus/Boeing.
It’s clear that this is the profile that will dominate avionics
for some time to come.
Both Airbus and Boeing are making new decisions on product
development and production, which will impact cable assembly and
connector manufacturers. Now interconnection industry
manufacturers must consider whether existing standards can be
used or whether new designs are necessary. A quick review shows
existing and new requirements in each of the six commercial
aviation interconnection application areas:
Avionics and in-flight
entertainment
Aircraft electrical
interconnection harnesses
Aircraft interiors
Wings, landing gear, and
engine
Power distribution
Sub-assemblies design
Boeing 747 Electronics Bay and Terminal blocks
Cable assemblies for interconnect products in avionics and IFE
(in-flight entertainment) will largely contain blind mate rack
and panel connectors; rugged MIL spec or other circular
connectors; RF connectors; terminal block type connectors; low
insertion force contacts; fiber-optic connectors; high-voltage
connectors; RFI protection; front release and rear release
contacts; environmentally sealed connectors; composite shelled
connectors; D-subminiature
connectors; micro-D connectors, filtered contacts, and
hermetically sealed connectors. One of the more recent
requirements for the rack and panel interconnection solution is
the IFE (In-Flight Entertainment System). ITT Interconnect
Solutions has developed a custom ARINC 600 connector designed
specifically for IFE systems (pictured right). More recently,
other new products are being developed, such as the “Fiber To
The Screen” product by Lumexis and TE, which reduces weight and
increases reliability with quasi-commercial designs.
The E/E (electrical equipment) bay determines much change
throughout the aircraft, as avionics box manufacturers continue
to innovate and pursue new markets and customers. One major new
market force is the entrée of global airliner manufacturers,
such as Comac and Irkut. As LRU (line replaceable unit)
manufacturers pursue new global aircraft builders in China and
Russia, these newcomers will provide certified avionics
solutions. Honeywell is developing the fly-by-wire flight
control system and the inertial reference system with China's
Flight Automatic Control Research Institute.
Rockwell Collins is the integrator on the ARJ21. It is also
developing the communication and navigation system jointly with
China Electronics Technology Avionics and an integrated
surveillance system with the Leihua Electronic Technology
Research Institute. Irkut has selected Rockwell Collins to
provide avionics and controls for the MS-21. Expect both
standards and new design modifications for these programs.
Future articles will address industry interconnect requirements
from concept to development to manufacture to the MRO and Life
Cycle Management of commercial aircraft. As defense spending
declines in the United States and in much of the Western world
and commercial aircraft are needed to replace aging fleets and
address new markets, expect to see significant innovation and
changes.
Tom Dlugolecki, Bishop & Associates
Inc.
Market Segment Director — Commercial Aviation, Bishop &
Associates Inc. Tom Dlugolecki joined Bishop &
Associates in 2011, and brings a military and corporate career
lifetime of aerospace and defense business and technical
knowledge. His knowledge of hardware/software design,
development, manufacture, and integration of complex
technological system/network products and services gives him
insights into the future of the electronic interconnectivity
industry. His primary focus is civil aerospace. He can be
reached at
tdlugolecki@bishopinc.com.
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