Siemon Launches Online Resource for Shielded Network Cabling
March 2010—Siemon has launched an online resource to help IT network and data center professionals get clear facts on shielded network cabling systems such as category 6A F/UTP and category 7A S/FTP solutions. At www.siemon.com/shielded, the focus is on key network infrastructure issues, such as 10Gb/s performance requirements, noise resistance, installation considerations, cost savings, and future-proofing. This site a portal to Siemon’s library of in-depth resources. From a simple, one-page list of key shielded cabling benefits, advantages, and myths, users can access instructional videos, whitepapers, customer case studies, and more.

Key topics:

• Shielded cabling market drivers

• Performance headroom

• Termination speed

• Installation practices

• Grounding and bonding

• Electromagnetic interference considerations

• Alien crosstalk resistance

• PoE and PoE Plus heat generation issues

• Security considerations

• Cable sharing as a high density work area solution

Visit Siemon online.

IPC-A-610E Released:
Industry Requirements for Acceptability of Electronic Assemblies Updated
April 2010—IPC-Association Connecting Electronics Industries® has released the E revision of IPC-A-610, Acceptability of Electronic Assemblies. IPC’s most widely used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board-in-board, package-on-package, depanelization, and additional SMT terminations.

The photos and drawings that illustrate good and bad connections, considered one of the most important features of IPC-A-610, have also been upgraded. The E revision contains 165 new or updated illustrations, bringing the total to more than 800.

In addition, the standard has been revamped for ease of use and clarity. Sections have been reorganized so data and images are easier to find. The many changes that have occurred in array packaging since the standard’s last revision are also addressed in the E revision, as are changes to hot tear and filet lifting. There are also new sections on depanelization, board-in-board, package-on-package, and flex attachment.

Designers and manufacturers will appreciate criteria for package-on-package technologies, often used to boost solid-state memory capacity, and for board-in-board connections, where daughter-boards can be mounted perpendicular to the assembly using a through-the-board method.

Upgrades to a companion document, J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, have also been made in a recent release of the standard’s E revision. IPC J-STD-001E provides material and process requirements for producing soldered electrical and electronic assemblies, aiding those who set up manufacturing processes.

Translations of the revised standard in multiple languages will be released in the coming months. For more information on IPC-610E, visit IPC online.